1. Thick Film Process: A conductive layer is formed by screen printing metal paste and high-temperature sintering.

Advantages: Low cost, suitable for mass production.

Disadvantages: Lower precision.

2. Thin Film Process (DPC, also known as Direct Plated Copper): High-precision circuits are formed using sputtering, electroplating, and lithography techniques.

Advantages: Suitable for high-precision, high-resolution, and high-frequency applications, LED, 5G, and optical communication applications.

Disadvantages: Higher cost.

3. Direct Bonded Copper (DBC): Copper foil is directly bonded to ceramic to form a high thermal conductivity substrate.

Features: High current carrying capacity and standard process for power module IGBTs.

4. Active Metal Brazing (AMB): High-strength bonding using active metals.

Features: High reliability and suitable for automotive and aerospace applications.

V. Process Comparison