EXCELLENT THERMAL MANAGEMENT
High thermal conductivity for efficient heat dissipation
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HIGH VOLTAGE INSULATION
Superior dielectric properties ensure electrical reliability
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HIGH RELIABILITY
Stable performance in harsh environments
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COMPACT & HIGH POWER DENSITY
Enabling smaller size and higher power output
OUR CERAMIC PCB
TECHNOLOGIES
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DPC
Fine-line ceramic substrates for semiconductor and RF applications
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DBC
High current and high power ceramic solutions for EV and industrial power electronics
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AMB
Enhanced reliability ceramic substrates for harsh operating environments
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Thick Film Printing
Cost-effective ceramic circuitry for hybrid electronics
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Ceramic-to-Metal Brazing
Custom ceramic-to-metal assemblies and vacuum brazing solutions
APPLICATIONS
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EV POWER ELECTRONICS
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SEMICONDUCTOR PACKAGING
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RF & MICROWAVE
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LED THERMAL MANAGEMENT
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AEROSPACE & DEFENSE
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MEDICAL EQUIPMENT
MATERIALS EXPERTISE
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ALUMINUM NITRIDE (AIN)
High thermal conductivity up to 170 W/mK
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ALUMINA (Al₂O₃)
Cost-effective solution with excellent electrical insulation
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SILICON NITRIDE (Si₃N₄)
Exceptional mechanical strength and thermal shock resistance
WHY CHOOSE TENSKY
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ENGINEERING-DRIVEN SOLUTIONS
Application-oriented technical support
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GLOBAL CERAMIC PCB RESOURCES
Access to qualified global manufacturing resources
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TECHNICAL CONSULTATION
Material selection and design optimization support
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FAST PROTOTYPING SERVICE
Rapid sampling and pilot production support
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GLOBAL PROJECT EXPERIENCE
Serving customers in Europe, North America and Japan
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RELIABLE SUPPLY CHAIN INTEGRATION
Effective supply chain management and on-time delivery
Comparison of DPC, DBC, and AMB Technologies
- Item
- DPC
- DBC
- AMB
- Circuit Precision
- Fine Pattern Capability
- High-Frequency Performance
- Thermal Performance
- Copper Thickness Capability
- Current Carrying Capacity
- Power Module Applications
- Optical Communication Applications
- Precision Packaging Applications
- Manufacturing Cost
FAQ
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AlN vs Al₂O₃ vs Si₃N₄: Which Ceramic Substrate Is Best?
2026/09/10Compare AlN, Al₂O₃, and Si₃N₄ ceramic substrates based on thermal performance, mechanical strength, reliability, and applications.
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Ceramic PCB vs FR4: Which One Should You Choose?
2026/09/10Compare Ceramic PCB and FR4 to find the right substrate for thermal performance, reliability, and application requirements.
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DPC vs DBC vs AMB: What Are the Differences?
2026/09/10Compare DPC, DBC, and AMB technologies to understand their processes, advantages, and suitable applications.
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What is Ceramic-to-Metal Brazing?
2026/07/28A brazing technology that creates strong, reliable, and hermetic ceramic-to-metal joints.