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  1. Advantages

    • Ultra-Fine Circuit Pattern Capability

    • Excellent High-Frequency Performance

    • High Design Flexibility and Advanced Packaging Capability

      DPC technology supports:

      1. Micro Vias
      2. Fine-Pitch BGA Designs
      3. Multilayer Interconnect Structures
      4. High-Density Packaging

    • Excellent Thermal Management

  2. Advantages

    • Excellent Thermal Management

    • High Current-Carrying Capability

    • Outstanding Thermal Cycling Reliability

    • Strong Metallurgical Bonding

    • Excellent Thermal Shock Resistance

    • Long Service Life

    • High Dielectric Strength

    • Excellent Electrical Insulation

    • Efficient Heat Dissipation

  3. Advantages

    • Outstanding Thermal Cycling Reliability

    • High Mechanical Strength

    • Excellent Thermal Management

    • High Current-Carrying Capability

  4. Advantages

    • Cost-Effective Manufacturing

    • High Design Flexibility

      Thick film technology supports printing of:

      1. Conductive Layers
      2. Resistor Patterns
      3. Dielectric Layers
      4. Protective Coatings
      5. Insulation Layers

    • Excellent Reliability
      Ceramic substrates provide:

      1. High Electrical Insulation
      2. High Temperature Stability
      3. Low Moisture Absorption
      4. Good Chemical Stability

    • Ideal for Ceramic Heater Applications

  5. Advantages

    • Hermetic Sealing Capability

    • Excellent High-Temperature Performance

    • High Dielectric Strength

    • Excellent Electrical Insulation

    • Low Leakage Current

    • Stable Electrical Performance

    • Long-Term Reliability

    Ceramic-to-metal brazed assemblies can be designed for demanding environments including:

    1. Thermal Cycling

    2. Vacuum Environments

    3. High Humidity Conditions

    4. Corrosive Atmospheres

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